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Product name: Company: CyberOptics Semiconductor, Inc. Specifications The EX-Q wafer mapping sensor, featuring reflective laser technology, enables quick and reliable detection of semiconductor wafers and slotting errors in cassettes or FOUPs. Available in four standoff distances — 1.5\", 2.2\", 3.0\" and 4.5\" — the EX-Q easily mounts on robots and is adaptable to a wide array of mapping applications, offering both on-and off-center wafer scans. It can accommodate mixed wafer batches — for example, dark or coated wafers can be combined with bright wafers — and is compatible with flatted or notched wafers of any size, including 300mm. Price : not set 
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