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THIN-FILM SOLAR CELL LASER EDGE DELETION SYSTEM

Compared with the traditional technics, this Thin-Film Solar Cell Laser Edge Deletion System delivers excellent performance with more efficiency, higher precision, and zero damages to the glass substrate. Additionally, the special dusting system avoids the secondary pollution of the traditional sand blast process.

UV LASER WAFER SCRIBING SYSTEMS

UltraScriber is a high precision laser system developed by Delphi Laser, specifically to support LED chip manufacturing. Substrates, such as Sapphire, Copper, Silicon, Cobalt as well as Alloy, can be scribed with high precision. This system has a very good quality and can achieve high throughput(10 pcs/hr) with long time reliabiltiy. UltraScriber has won much good reputation among customers, and is accepted widely in the LED industrial.TripleScriber is another UV laser scribing system which is sepecially developed for scribing small size chips with high throughput.Features• 4 Dimentional high precision adjust system for position • 3 Co-Axial CCD image indentifying system • Real-time monitoring for laser power • Powerful vision system for anti-roughness on chip surface• High stability shock-proof system with granite• Process memory systemApplication Materials Sapphire, Ceramic, Quartz, Diamond, Silicon as well as Copper, Cobalt, and many AlloysApplicationsLED and other wafer production industriesSpecifications UltraScriber / TripleScriberChip Size ≥ 6 milScribing Depth 22-45 umBeam Number Single / ThreeRotation Stage ±7°with 0.0001°Res.X-Y axis resolution 0.1 umZ axis resolution 1 umThroughput > 15pcs/h @ 14 mil

UV LASER PRECISION MICRO MACHINING SYSTEM

With strong technical capability and process experience, delphilaser successful developed a new generation high-end laser system. This system delivers high performance in cutting, drilling and surface treatment in glass, Ceramic, Sapphire, Silicon, Cu, Alloys and organic films with high throughput, good quality and flexibility. Specifications:Wavelength : 355nm Pulse width : 8-15ns Average power : 3W6W8W Pulse energy stability : <3%rms Maximum aspect ratio : 4:1 Minimum diameter : 70um Features : 1. High efficiency, high stability 2. Small thermal effect, excellent in shape 3. Suitable for a variety of graphics formats 4. High density drilling Applications : Main applications in micro-drilling, cutting on glass, Ceramic, Sapphire, Silicon, Cu, Alloys and organic films, especially on hard and brittle materials such as glass, Ceramic, Sapphire,etc.

GREEN LASER ND:YAG

Laser Information BL532002-02 series acousto-optic Q-pulsed green light laser, using the advanced cavity design and laser control technology to achieve excellent beam quality, higher long-term job stability, narrow laser pulse width in high-power lasers operation. Special intra-cavity thermal compensation technique and harmonic conversion technology to achieve high efficiency conversion.This series of lasers using Nd:YAG crystal as the gain medium in order to obtain larger single-pulse energy under low operating frequency of the laser. Laser Characters Clean Laboratory package TEM00 mode output base (M2 <1.2) Long-term work stability Small size, compact structure Stand-alone and RS232 computer control, external GATE control, external TTL and PWM control Repetition rate adjustable 10-100kHZ LD module can be replaced at the sceneApplications Mainly applies in the quartz carves, material mark, crafts carving and so on. MODELBL532002-1.5BL532010-04BL532010-08BL532010-10Wavelength(nm)532nmPulse Repetition Rate Range: 10Hz to 100kHzPulse Width (ns):9ns@2kHZ20ns@10kHz25ns@10kHz25ns@10kHzAverage Power(W): 1.5W@2kHz4W@10kHz8W@10kHz10W@10kHzAverage Power Stability :<±3% over 12 hoursPulse Energy(uJ):750uJ400uJ800uJ1000uJPulse-to-Pulse instability:<3%rmsSpatial Mode: TEM00(M2 <1.2)TEM00(M2 <1.5)Beam Divergence Full Angle :< 2 mrad1/e2 Beam Diameter :0.5 mmBeam Roundness:>90%Pointing stability:<50uradPolarization DirectionVerticalPolarization Ratio100:1Operating Voltage90-260VACCoolingAir-cooling/Water-coolingAmbient Temperature(oC)15-30Storage Temperature(oC)-10-50

INFRARED LASER (ND:YVO4)

Laser CharactersClean Laboratory PackageTEM00 mode output base (M2 <1.2)Long-term work stabilitySmall size, compact structureStand-alone and RS232 computer control, external GATE control, external TTL and PWM controlRepetition rate adjustable 10-100kHZLD module can be replaced at the scene ApplicationsMarkingCuttingEngravingThermal printingScientific researchPrecision Drilling MODEL BLIR100-10 Wavelength(nm) 1064 Pulse Repetition Rate Range : 10HZ to 100kHZ Pulse Width (ns) @30kHZ: 20 Maximum Output Power(W) 7W at 30kHZ ;10W@CW Average Power Stability : < ± 3% over 12 hours Pulse Energy(uJ) @30kHZ: 230 Spatial Mode: TEM00 (M2<1.2) Beam Divergence Full Angle : < 2 mrad 1/e2 Beam Diameter : <1 mm Beam Roundness: >90% Polarization Direction Horizontal Polarization Ratio >100 : 1 Operating Voltage 220/110VACLine Frequency(HZ) 47-63HZ Cooling Air-cooling/Water-coolingAmbient Temperature(oC) 15-30 Storage Temperature(oC) -10-50

PICO SECOND LASER PRECISION MICRO MACHINING SYSTEM

Pico Second Laser Precision Micro Machining System is equipped with ultra short pulse lasers developed by Delphi Laser. The system is specially designed to perform high quality micro-drilling, cold-cutting, grooving and milling. With minimum thermal effect, free selection of taper and debris free, Deep Pioneer has realized many applications with Metal, Ceramic, Semiconductor and Polymers, which will sure meet your needs. Specifications Wavelength : 1064, 532 or 355nm Pulse Width : < 12ps Average Power : 2W, 10W and 25W Frequency : 200Khz to 1 MHz Minimum Diameter : 30um Maximum Aspect Ratio : 20 : 1 System dimension : 2.5m × 1.2m × 2m (L×W×H) Features of Pico Second Laser Precision Micro Machining System : No thermal effect & Smooth processing edge Not selective to materials Suit for processing any structures Free selection of taper(Positive, negative or zero) High throughput due to high repetition rate and high power Applications Micro-drilling, micro-cutting, grooving, milling in Metal, Ceramic, Semiconductor,Polymer, glass and other materials.

GREEN LASER (ND:YVO4)

Laser information BL532100 series acousto-optic Q-switched green laser, using the advanced cavity design and laser control technology to achieve excellent beam quality, narrow laser pulse width in high-power lasers operation. Special intra-cavity thermal compensation technique and harmonic conversion technology to achieve high efficiency conversion.This series of lasers using Nd:YVO4 crystal as the gain medium. demands a little for single pulse energy. It is ideal choice for users requiring higher repetition rate. Laser Characters Clean Laboratory package TEM00 mode output base (M2 <1.2) Long-term work stability Small size, compact structure Stand-alone and RS232 computer control, external GATE control, external TTL and PWM control Repetition rate adjustable 10-100kHZ LD module can be replaced at the scene Applications Mainly applies in thin film solar cell etching and monocrystalline silicon. MODEL BL532100-04 BL532100-06 BL532100-08 BLUV100-10 Wavelength(nm) 532 Pulse Repetition Rate Range : 10HZ to 100kHZ Pulse Width (ns) @30kHZ: 18 Average Power(W) @30kHZ : 4.0 6.0 8.0 10.0 Average Power Stability : < ± 2% over 12 hours Pulse Energy(uJ) @30kHZ: 130 200 260 330 Spatial Mode: TEM00(M 2 <1.2) Beam Divergence Full Angle : < 2 mrad 1/e2 Beam Diameter : 0.5 mm Beam Roundness: >90% Polarization Direction Vertical Polarization Ratio >100 : 1 Operating Voltage 220/110VAC Line Frequency(HZ) 47-63HZ Cooling Air-cooling/Water-coolingAmbient Temperature(oC) 15-30 Storage Temperature(oC) -10-50

UV LASER (ND:YVO4)

Laser Information BLUV100 series LD pumped acousto-optic Q-switched UV laser, using the advanced cavity design and laser control technology to achieve excellent beam quality, higher long-term job stability, narrow laser pulse width in high-power lasers operation. Special intra-cavity thermal compensation technique and harmonic conversion technology to achieve high efficiency conversion.This series of lasers using Nd: YVO4 crystal as the gain medium in order to obtain better output characteristics under high operating frequency of the laser. Laser Characters Clean Laboratory Package TEM00 mode output base (M2 <1.2) Long-term work stability Small size, compact structure Stand-alone and RS232 computer control, external GATE control, external TTL and PWM control Repetition rate adjustable 10-100kHZ LD module can be replaced at the scene Applications Mainly applies in the ITO thin film etching, fast formation, LED wafer cutting, scribing, lineation, lattice, as well as ultraviolet pore processing and so on. MODELBLUV030-02BLUV030-03BLUV030-04BLUV030-06BLUV030-08Wavelength(nm)355Pulse Repetition Rate Range: 10Hz to 150kHz(Options:single shot to 200kHz)Pulse Width (ns) @30kHZ:18Average Power(W) @30kHZ : 2.03.04.06.08.0Average Power Stability :<±2% over 12 hoursPulse Energy(uJ) @30kHZ:66100133200266Pulse-to-Pulse instability:<3%rmsSpatial Mode: TEM00(M2 <1.2)TEM00(M2<1.5)Beam Divergence Full Angle :< 2 mrad1/e2 Beam Diameter :0.5 mmBeam Roundness:>90%Pointing stability:<50uradPolarization DirectionHorizontalPolarization Ratio100:1Operating Voltage90- 260 VACCoolingWater-cooling/Air-coolingAmbient Temperature(oC)15-30Storage Temperature(oC)-10-50

THIN FILM SOLAR CELL LASER SCRIBING SYSTEMS

Thin Film Solar Cell Laser Etching Systems for Thin Film Solar Cell manufacturing is equipped with a 532nm/1064nm high power laser. The system can efficiently and accurately etch different thin films on glass substrates. The systems is highly reliable with low operating cost. Customized functionalities and features can be made available on requests. Features: 1. X-Y-Z three-dimensional adjustment 2. CCD assisted automatic positioning 3. Dust collecting system 4. Laser protecting system 5. Laser beam stabilization system 6. Friendly operating interface, real-time display of etching paths Advantages: 1. Simple operation, few processing steps 2. Reliable and high production capability 3. A lager etching rang width 4. High processing speed Applicable Films: -- A-Si -- CIS/CIGS -- CdTe Specifications: Glass substrate size: 1100mmX1400mm Approx. Productivity: 3min/pcs(with two laser beams) Max etching speed: 1000mm/s Bearing weight: 150Kg Repositioning accuracy: +/-0.01mm Focal length: F=100-200mm Wavelength: 1064nm/532nm Exhaust system: Φ150 Air compressor: Up to 0.4Mpa 200L/min Power supply: 3 phase 380V/40A System dimension: L3800mm*W1700mm*H2000mm

LASER ETCHING SYSTEM FOR ITO PATTERNING

Laser etching system for ITO remove is an efficient equipment for patterning a variety of Indium Tin Oxide files coated on glass and plastic substrates as typically used in LCD panel display and touch panel display. It is a dry etching, non-contact single step, direct writing, maskless and ablative process. This laser etching system provides very reliable and repeatable performances. The operation has little consumables. Further more, this system provide a very high electrical isolation on ITO film with required etching line width, which is one of the most important aspects for a high quality ITO film applications such as in mobile phones. Advantages: Single step operation 24hour/day and 7days/week reliable production with minimum maintenances No need of extra toxic and polluting materials High accuracy and good resolutions Very high process speed Features: X-Y-Z- θ four dimensional adjustment for automatic positioning CCD assisted automatic patter recognition Laser safety protection system Patented technology for beam shaping Dust collection system Process expert system Friendly operating interface with required languages