Pico Second Laser Precision Micro Machining System

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Pico Second Laser Precision Micro Machining System

Suzhou Delphi Laser Co., Ltd >>

Description

Pico Second Laser Precision Micro Machining System is equipped with ultra short pulse lasers developed by Delphi Laser. The system is specially designed to perform high quality micro-drilling, cold-cutting, grooving and milling. With minimum thermal effect, free selection of taper and debris free, Deep Pioneer has realized many applications with Metal, Ceramic, Semiconductor and Polymers, which will sure meet your needs.

Specifications
Wavelength : 1064, 532 or 355nm
Pulse Width : < 12ps
Average Power : 2W, 10W and 25W
Frequency : 200Khz to 1 MHz
Minimum Diameter : 30um
Maximum Aspect Ratio : 20 : 1
System dimension : 2.5m × 1.2m × 2m (L×W×H)

Features of Pico Second Laser Precision Micro Machining System :
No thermal effect & Smooth processing edge
Not selective to materials
Suit for processing any structures
Free selection of taper(Positive, negative or zero)
High throughput due to high repetition rate and high power

Applications
Micro-drilling, micro-cutting, grooving, milling in Metal, Ceramic, Semiconductor,Polymer, glass and other materials.

Product line:	Lasers, Laser Systems and Accessories
Subcategories:	Laser Systems Ablation

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