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UV Laser Precision Micro Machining System

Uv Laser Precision Micro Machining System

Suzhou Delphi Laser Co., Ltd >>

Description

With strong technical capability and process experience, delphilaser successful developed a new generation high-end laser system. This system delivers high performance in cutting, drilling and surface treatment in glass, Ceramic, Sapphire, Silicon, Cu, Alloys and organic films with high throughput, good quality and flexibility.
Specifications:
Wavelength : 355nm
Pulse width : 8-15ns
Average power : 3W6W8W
Pulse energy stability : <3%rms
Maximum aspect ratio : 4:1
Minimum diameter : 70um

Features :
1. High efficiency, high stability
2. Small thermal effect, excellent in shape
3. Suitable for a variety of graphics formats
4. High density drilling

Applications :
Main applications in micro-drilling, cutting on glass, Ceramic, Sapphire, Silicon, Cu, Alloys and organic films, especially on hard and brittle materials such as glass, Ceramic, Sapphire,etc.

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