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Testimonials
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Read full testimonial »Material processing | Adhesives
Aquabond 65 is a formulation with the properties of both Aquabond 55â„¢ and Aquabond 85â„¢. It is a great all purpose product for either lapping and grinding or slicing and dicing hard, single crystal materials. All Aquabond temporary adhe...
Aquabond
Aquabond 85 has the highest melting and bonding temperature and is used as a backfill for bonding parts that are not flat. It is also used for grooving, cutting, slicing and dicing hard, single crystal materials. This product has higher tensile stren...
Aquabond
Aquabond 55 has the lowest melting and bonding temperature( 55C with max wetting at 110C) and is generally used for fiber coating, backgrinding, wafer bonding and wafer thinning and slicing and dicing. It puddles quickly and can spread as thin as fou...
Aquabond




